SiCarrier’s Ambitious Roadmap for ASML-Compatible Lithography Machines by 2026
SiCarrier, a Chinese chip equipment firm, plans to release ASML-compatible lithography machines by 2026, focusing on 300-mm wafers at 28nm processes. The company is collaborating with multiple fabs and expects to announce commercial orders by 2025. SiCarrier aims to expand its R&D and service centers globally, enhancing domestic semiconductor manufacturing capabilities while maintaining a diverse product line.
At SEMICON China, SiCarrier, a prominent Chinese chip equipment firm, outlined its ambitious plans to produce ASML-compatible lithography machines by 2026. These machines will focus on processing 300-mm wafers at 28nm technology. This strategic move is expected to enhance domestic semiconductor manufacturing capabilities. Market Director Zhao Min emphasized the company’s commitment to ensuring full compatibility with current tools used in local semiconductor fabs.
According to Chief Technology Officer Chen Dong, SiCarrier is collaborating with multiple fabs to establish joint laboratories and anticipates revealing its first commercial orders by late 2025. The firm has captured significant market interest, securing partnerships with key players like SMIC and Hua Hong Group, and has commenced production with etching equipment for power semiconductor applications.
SiCarrier aims to significantly expand its research and development footprint, proposing to develop R&D centers in more than ten cities in the next three years, alongside establishing service centers across Europe and Southeast Asia. Founded in 2022, SiCarrier is backed by experienced industry personnel, including Dai Jun, who plays a vital role in China’s semiconductor investment landscape through positions with the Big Fund II and SMIC.
The company gained attention this year by securing a patent for manufacturing 5nm chips utilizing DUV tools, which is reportedly linked to Huawei’s advanced 7nm chip featured in the Mate 60 Pro. At SEMICON China, SiCarrier showcased a broad array of semiconductor manufacturing tools, notably in metrology and inspection, while keeping its lithography tools more discreet. Despite this, reports confirm that the company possesses lithography machines capable of handling both 28nm and previous process nodes.
SiCarrier’s diverse offerings cover nearly all aspects of front-end semiconductor production stages, including metrology, inspection, and testing equipment, reinforcing its position in the semiconductor equipment landscape.
In conclusion, SiCarrier is making significant strides in the semiconductor equipment industry, with an ambitious roadmap that includes launching ASML-compatible lithography machines by 2026. The company is not only enhancing its technological capabilities through strategic partnerships and expansions but also playing a crucial role in bolstering China’s semiconductor production capabilities. With a focus on innovation and collaboration, SiCarrier is poised to become a prominent player in the global semiconductor market.
Original Source: www.trendforce.com
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